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Package Information
Vishay Siliconix
TO-251AA (HIGH VOLTAGE)
E1
4
Thermal PAD
3
E
4
b 4
A
0.010 0.25 M C A B
A
c2
θ 2
L2 4
θ 1
A
D1
4
B
3
C
Seating
5
plane
(Dat u m A)
L1 L3
C
C
L
B
B
A
3 x b 2
c
A1
V ie w A - A
2xe
3x b
0.010 0.25 M C A B
Base
Lead tip
Plating
5
b 1, b 3
metal
(c)
c1
5
( b , b 2)
Section B - B and C - C
MILLIMETERS
INCHES
MILLIMETERS
INCHES
DIM.
A
A1
b
MIN.
2.18
0.89
0.64
MAX.
2.39
1.14
0.89
MIN.
0.086
0.035
0.025
MAX.
0.094
0.045
0.035
DIM.
D1
E
E1
MIN.
5.21
6.35
4.32
MAX.
-
6.73
-
MIN.
0.205
0.250
0.170
MAX.
-
0.265
-
b1
0.65
0.79
0.026
0.031
e
2.29 BSC
2.29 BSC
b2
b3
b4
c
c1
c2
0.76
0.76
4.95
0.46
0.41
0.46
1.14
1.04
5.46
0.61
0.56
0.86
0.030
0.030
0.195
0.018
0.016
0.018
0.045
0.041
0.215
0.024
0.022
0.034
L
L1
L2
L3
θ 1
θ 2
8.89
1.91
0.89
1.14
0'
25'
9.65
2.29
1.27
1.52
15'
35'
0.350
0.075
0.035
0.045
0'
25'
0.380
0.090
0.050
0.060
15'
35'
D
5.97
6.22
0.235
0.245
ECN: S-82111-Rev. A, 15-Sep-08
DWG: 5968
Notes
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Dimension are shown in inches and millimeters.
3. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.13 mm (0.005") per side. These dimensions are measured at the
outermost extremes of the plastic body.
4. Thermal pad contour optional with dimensions b4, L2, E1 and D1.
5. Lead dimension uncontrolled in L3.
6. Dimension b1, b3 and c1 apply to base metal only.
7. Outline conforms to JEDEC outline TO-251AA.
Document Number: 91362
Revision: 15-Sep-08
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